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some of the industry pundits are comparing the iPhone 17 upgrade cycle to the 2020-2021 year as some of the iPhone 12, 30 users upgrade
How long will these supply impact your ability to ship to true demand
Does the consumer reception and iPhone Air gives you a feel on perhaps the foldable corn market? Or are the 2 form factors very different
Will you continue to use a 3-pronged approach with your own foundation models and partner with other LLM providers and maybe potential M&A
Do you feel like you need to accelerate your AI road map or just keep the organic focus
is the focus still around enterprises on Vision Pro? Or are you thinking of broadening the use cases and maybe tying it to more of your devices
Do you guys see the upgraded series expected in April as something that will, let's say, be the killer application among the suite of features
How do you guys see the potential tariff impact to your product for consumer demand under Trump 2.0 you guys did find under Trump 1.0
how does that fit with your JV with Besi, what is the adoption time line for large panel packaging
you said there are 10 new projects in the pipeline, and there's a lot of investor interest in Terafab
Can you talk about your confidence in maintaining your market share at that inflection? And when will the decisions come out?
you mentioned the NAND modest growth less than 10% of WFE. Are you expecting any capacity additions in NAND this year?
if the assumption is that the domestic China spending is coming down next year, why wouldn't this number be lower than mid-25%
Can you also comment on the silicon systems? Do they return to sequential growth in the July quarter
you talked about China being 20% of your sales on a normalized basis next year. Is that still your view?
who is driving the decision-making on networking hardware on these announcements
Curious if you have any sense how big this TAM is in 3 years
Can you give us a bit more color – are you seeing any pull forward because of the concern on tariffs
you are reiterating $750 million AI back-end sales this year despite the stalled or the fifth customer
Are you seeing an acceleration over there?
what else is driving sustainable outlook for operating margins of 17%
I'm curious if you have some sort of a TAM number for these new kind of projects
can you talk about the linearity of the orders in Q1? And are you expecting orders to outpace revenues in Q2
why wouldn't it be faster if the AI guys are supporting faster adoption of 6G
Are you stronger on the logic or the side or the HPM side? And what are your thoughts about hybrid bonding adoption?
Can you talk about your full year outlook on the services for this year?
Were those like trailing edge logic projects or was it a DRAM contribution in those sales?
How are you guys leaning into the two struggling foundries and what impact that could have both this year
something has changed versus 90 days ago, you guys are talking about NAND growing through the year
customer down payments at [indiscernible] level in 4 years. And you're also talking about WFE growing in next year
when do you see the volume adoption of 4F from 6F2? And can you talk about your SAM market share when you moved to four S Square?
is it safe to assume that the CSBG business snaps back next year in a more meaningful way, given the restrictions
One of your North American customers is going through some major restructuring and we get from investors if you guys have baked in
a quick clarification that $100 billion WFE number is unrestricted WFE, meaning it includes your expectations
has your thinking about the sales contribution mix from the two programs at this customer ramp changed from 90 days ago?
if you can touch on the importance of CUDA as now more of the investment dollars in AI are coming from inference workloads
April quarter is the bottom
on the last earnings call, you mentioned that sovereign demand is in low double-digit billions. Can you provide an update on that
Are you more optimistic on new HBM qualifications in Korea? Or is it HBM4 that's driving the improved outlook?
Is that packaging technology the driver where you feel like you can insert your testers?