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Analyst
Laura Chen
Period: Reporting periods mapped to calendar 2024 Q4 – 2026 Q3 (8 quarters).
- Questions
- 17on tracked calls
- Challenge rate
- 0%none of 17 questions
- Companies
- 1questioned at least once
- Reporting periods
- 8with questions
These figures cover the whole profile: every tracked question, all reporting periods.
How to read these numbers
Challenge rate is the share of questions that pushed back, pressed for specifics or questioned management’s assumptions. It describes how questions were asked on the calls tracked here; it does not measure whether any view turned out to be right.
Rounding. Rates are rounded to whole percentages, so a small share can show as 0% even when some questions were challenging. The count beside each rate is exact; “none of N questions” means no question was challenging.
No questions recorded. “—” means there is nothing to calculate: no questions were recorded for that period on the calls tracked here. It does not mean there was no activity.
Fewer than 3 questions. A company-level rate is withheld when fewer than 3 questions were recorded for that company; the questions are still counted everywhere else.
Small samples. Profiles with fewer than 10 questions are marked Limited sample.
Reporting periods. Questions are grouped by the calendar quarter each company’s fiscal reporting period maps to, not by the date of the call. Periods without a calendar mapping are listed separately under their fiscal label.
Questions asked
Grouped by company, most questions first. Open a company to read its questions, newest reporting period first.
Showing 17 of 17 questions from 1 company
TSMTaiwan Semiconductor Manufacturing Company Limited17 questions · 8 reporting periods · 0 of 17 challenging
Calendar 2026 Q3
Any update on your AI CAGR growth? I recall previously we talking about like a high 50%.
Show response
Gave no new number but signaled the AI accelerator CAGR will probably be higher than previously guided.
how would TSMC adjust your capa-minimize the potential overbuilding in the supply chain?
Show response
Said every constraint (CSP capex, data center build-out, power, components) is factored into planning and demand still exceeds supply.
how should we think about the pricing power and also the long-term gross margin and the capital efficiency return?
Show response
Confirmed High NA use in 2030 and said profitability has no ceiling but will not jump overnight; gave no margin target.
Calendar 2026 Q2
Can you give us more update among that AI, different kind of chips between GPU, accelerators, or CPU?
Show response
Declined specific numbers but said all AI chip types are TSMC customers using the same leading-edge technologies, with wafer allocation balanced.
if you can give us more technologies progress update on the different kind of technology for glass core or glass substrates or glass carrier.
Show response
CoWoS remains the majority; a pilot line for lower-cost alternatives is being built and should be production-mature in about a year.
Calendar 2026 Q1
do you think that the following road map like SoIC or like CoPoS can solve this kind of technical issue?
Show response
C.C. Wei said TSMC's packaging experience gives confidence to solve mechanical-stress/warpage challenges with customers, but declined to speed up or slow down a specific roadmap.
what will be the business model working with your OSAT partners
Show response
C.C. Wei said advanced packaging capacity is very tight so TSMC works with OSAT partners to support customers, without detailing a specific business model.
Calendar 2025 Q4
can you remind us that what would be the revenue contribution last year for the advanced packaging overall?
Show response
Huang quantified 2025 advanced packaging revenue at about 8% (close to 10%), expected slightly over 10% this year, with rising CapEx allocation.
I'm just wondering how does TSMC evaluate the potential power electricity supply for data center.
Show response
Wei said customers planned power years ahead and view TSMC silicon, not electricity, as the current bottleneck, so power is not a near-term constraint.
Calendar 2025 Q3
specifically on N3, do we also need to add more capacity into next year, newly added capacity?
Show response
C.C. Wei said they optimize existing N5/N3 capacity but new buildings are dedicated to N2 rather than fresh N3 capacity.
TSMC previously also planned to expand advanced packaging in Arizona. So can you give us an update here?
Show response
C.C. Wei confirmed two advanced packaging fabs planned in Arizona and that TSMC is also working with an OSAT partner already breaking ground there.
Calendar 2025 Q2
how do you kind of prioritize your leading-edge advanced packaging
Show response
C.C. Wei said TSMC develops packaging technology in step with customer demand, building a variety of back-end advanced packaging solutions that are tied to its leading-edge nodes.
can we kind of consolidate our mature nodes to kind of make better efficiency and capabilities
Show response
C.C. Wei said TSMC differentiates its mature nodes through specialty technologies such as RF, CMOS image sensors and high voltage, so it is not worried about industry mature-node overcapacity.
Calendar 2025 Q1
Do you see any structural change in the future AI chip design when moving to N3
Show response
C.C. Wei said customers increasingly adopt CoWoS/SoIC advanced packaging; panel-level packaging is still feasibility-stage and would most likely ramp in Taiwan first.
Can we also assume that the same scale like 30% of your Arizona fab for the advanced node in the longer term?
Show response
C.C. Wei confirmed 2-nanometer as the major Arizona node with ~30% there once the six-fab cluster scales; 1.4/1.0 allocation not yet decided.
Calendar 2024 Q4
can you provide us more update about what the HBI base die business opportunities could be?
Show response
C.C. Wei confirmed engagement with all memory suppliers but said meaningful volume is a half-to-one year away.
what's your view on the traditional applications like a PC and the smartphone growth, and particularly for this year?
Show response
C.C. Wei answered directly: only mild PC/smartphone unit growth, but AI content, silicon growth and shorter replacement cycles add upside.
Challenge rate by company
Every company this analyst questioned, most questions first. A company-level rate is shown from 3 questions; below that it is withheld.
| Company | Questions | Challenge rate |
|---|---|---|
| TSM Taiwan Semiconductor Manufacturing Company Limited | 17 | 0%none of 17 questions |
- TSMTaiwan Semiconductor Manufacturing Company Limited · 17 questions0%none of 17 questions
Activity by reporting period
Questions recorded for each calendar quarter that companies’ reporting periods map to (not the call date), with the challenge rate for that period. Periods inside the range with no questions are shown as “No questions recorded”.
| Calendar period | Questions | Challenge rate | Companies |
|---|---|---|---|
| 2024 Q4 | 2 | 0%none of 2 questions | 1 |
| 2025 Q1 | 2 | 0%none of 2 questions | 1 |
| 2025 Q2 | 2 | 0%none of 2 questions | 1 |
| 2025 Q3 | 2 | 0%none of 2 questions | 1 |
| 2025 Q4 | 2 | 0%none of 2 questions | 1 |
| 2026 Q1 | 2 | 0%none of 2 questions | 1 |
| 2026 Q2 | 2 | 0%none of 2 questions | 1 |
| 2026 Q3 | 3 | 0%none of 3 questions | 1 |
- 2024 Q42 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2025 Q12 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2025 Q22 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2025 Q32 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2025 Q42 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2026 Q12 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2026 Q22 questions · challenge rate 0% (none of 2 questions) · 1 company
- 2026 Q33 questions · challenge rate 0% (none of 3 questions) · 1 company
Topics
Topics tagged on this analyst’s questions.
- Capex Investment6
- Demand6
- Innovation & R&D5
- Cloud & AI4
- Supply Chain4
- Revenue Growth3
- Geographic Expansion3
- Margin2
- Competitive Dynamics2
- Product Launch2
Show all 11 topics
- Pricing1