Taiwan Semiconductor Manufacturing Company Limited TSM

“continue to collaborate closely with TSMC on its CoWoS platform”

Marvell is co-developing MRM-based scale-up interconnect on TSMC's CoWoS advanced-packaging platform, underscoring TSMC's role enabling Marvell's photonics roadmap.

“I just wanted to revisit TSMC recent comments on High-NA systems being too expensive.”

An analyst cites TSMC's public view that High-NA systems are too expensive, implying TSMC may lean on Low-NA multi-patterning rather than early High-NA adoption.

“we announced our EPIC co-development engagement with TSMC, who joined as a founding partner together with Micron, Samsung and SK Hynix.”

TSMC joined Applied's EPIC co-innovation platform as a founding partner, a positive signal for the depth of Applied's engagement with the leading foundry.

“if on the back end competition is rising, especially coming from Intel EMIB-T”

An analyst frames Intel's EMIB-T advanced-packaging technology as rising back-end competition; TSMC downplays it, saying tight packaging capacity means competitor flexibility helps its front-end wafer business.

“TSMC make it clear that we work with ASML and try to make it more suitable for manufacturing in terms of the cost and in terms of the maturity.”

TSMC is collaborating with ASML on High-NA EUV but flags cost and maturity as gating factors for adoption, a mixed signal for ASML's newest tools.

“ASML just announced to expand the EUV capacity for 2028.”